Mobile Phone Repair Non-Standard Motherboard Heating Table Supports Layered Bonding Tin Plating Degumming, EU Plug, LS2 MINI

1. Voltage: 220V
2. Power: 160W
3. Current: 0.73A/1.45A
4. Temperature setting range: 0-260 degrees Celsius
5. Working size: about 7 x 10cm
6. Size: about 10 x 12.2 x 10.2cm
7. Weight: about 250g

Features:
1. Intelligent temperature control, 0-260 degrees Celsius free temperature control, precise temperature control
2. Precise positioning, suitable for mobile phone motherboards of various sizes
3. Small and light, mini and space-saving
4. Uniform heating, aluminum alloy panel design, good thermal conductivity
5. Suitable for special-shaped motherboards of mobile phones, supporting layering, lamination, tinning, glue removal, etc.
6. Three-dimensional heat dissipation shutters, upper and lower isolation of the chassis and the heating plate, multi-directional convection heat dissipation windows of the chassis, dissipation of excess heat, durable and safe
7. Three-core power cord socket, equipped with a safety fuse tube, burn-proof, insulation design to prevent leakage, protect the service life of the machine